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AssigneeIntel Corporation
InventorsBassam ZIADEH, Jingyi HUANG, Yiqun BAI, Ziyin LIN, Vipul MEHTA, Joseph VAN NAUSDLE
Estimating the term…
Embodiments described herein may be related to apparatuses, processes, and techniques related to hydrophobic features to block or slow the spread of epoxy. These hydrophobic features are placed either on a die surface or on a substrate surface to control epoxy spread between the die in the substrate to prevent formation of fillets. Packages with these hydrophobic features may include a substrate, a die with a first side and a second side opposite the first side, the second side of the die physically coupled with a surface of the substrate, and a hydrophobic feature coupled with the second side of the die or the surface of the substrate to reduce a flow of epoxy on the substrate or die. In embodiments, these hydrophobic features may include a chemical barrier or a laser ablated area on the substrate or die. Other embodiments may be described and/or claimed.
A package comprising:
A method comprising:
A package comprising:
The package of 18, where in the first side of the first die is etched after the flow of the adhesive and prior to physical coupling of the second side of the second die to the first die.
Dependencies are inferred from the claim text.