Back to results
US 2024/0402302 A1Published application
Tof module leveraging foplp technology
AssigneeII-Vi Delaware, Inc.
InventorsFrancesco Schiattone, Jason O’Daniel, Pei-Song Cai, Hong-Zhi Liu, Yi-Yung Chen
Life of this patent
Estimating the term…
Abstract
This disclosure describes a Time of Flight (ToF) device leveraging semiconductor Fan-Out Panel Level Packaging (FOPLP) technology. The ToF device comprises a laser, a transmit optical assembly (TxO), a receive optical assembly (RxO), and a time of flight (ToF) sensor. The laser and the ToF sensor are embedded in a first compound. The TxO and the RxO are embedded in second compound that is different than the first compound.
Claims20
A device, comprising:
- a laser;
- a transmit optical assembly (TxO);
- a receive optical assembly (RxO);
- and
- a time of flight (ToF) sensor, wherein:
- the laser and the ToF sensor are embedded in a first compound, and
- the TxO and the RxO are embedded in a second compound that is different than the first compound.
4 more elements
Dependencies are inferred from the claim text.