Memory device including a plurality of pads and method of detecting crack of pads thereof
AssigneeSamsung Electronics Co., Ltd.
InventorsDojong CHUN, Jungwook KIM, Minsu PARK, Ji-Suk KWON, Seokjae LEE
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AssigneeSamsung Electronics Co., Ltd.
InventorsDojong CHUN, Jungwook KIM, Minsu PARK, Ji-Suk KWON, Seokjae LEE
Estimating the term…
Disclosed is a memory device. The memory device includes a memory cell array; a first pad configured to receive a command from an external device; a second pad configured to exchange data with the external device; a third pad; test logic configured to generate a test pulse signal based on a test command received through the first pad; and a crack detection structure formed below the third pad and configured to include lines connected in series from the test logic to the second pad. A crack occurring in the third pad is detected based on a delay of a delay pulse signal changed when the test pulse signal passes through the crack detection structure.
A memory device comprising:
A method of detecting cracks in a memory device, the method comprising:
A memory device comprising:
Dependencies are inferred from the claim text.