Seal part forming method and device assembling method
AssigneeHitachi Astemo, Ltd.
InventorsYuuichirou YOSHITAKE, Masao FUJIMOTO
Life of this patent
Estimating the term…
Abstract
The periphery of a coil terminal portion (9) which penetrates a bottom wall portion (7a) serves as a first seal part forming location (A), and is sealed by an FIPG. The FIPG is used for sealing the spaces between a housing (7) and a motor cover (5) and between a connector member (4) and the motor cover (5) serving as second seal part forming locations (B). A FIPG made of a two-pack room-temperature curing silicone adhesive is used instead of a one-pack thermosetting FIPG, two liquid agents are heated to 60° C. and then are mixed in a static mixer, and the mixture is applied to the seal part forming locations (A, B). The curing time is shortened by preheating, thereby achieving sufficient curing in approximately two hours.
Claims13
-7. (canceled)
A seal part forming method for forming a seal part between members by using an adhesive capable of being cured at room temperature by mixing a plurality of liquid agents with each other, the method comprising:
- a heating step for heating the plurality of the liquid agents to a temperature higher than at least room temperature, before or after the mixture;
- and
- an application step for applying the adhesive formed by the mixture to a seal part forming location, in the heated state.
A seal part forming method for forming a seal part between members by using an adhesive capable of being cured at room temperature by mixing a plurality of liquid agents with each other, the method comprising:
- an application step for applying the adhesive formed by the mixture to a seal part forming location;
- and
- a heating step for heating a whole of a member to which the adhesive has been applied or part of a member including at least a part at which the adhesive has been applied to a temperature higher than at least room temperature.
Dependencies are inferred from the claim text.