Thermosetting composition, electronic device, and method for producing electronic device

Abstract

An object of the present disclosure is to provide a thermosetting composition having an excellent thermosetting property, a photocurable property allowing for temporary bonding, and a long pot life. A thermosetting composition contains: a resin (A) including at least one type of group selected from the group consisting of epoxy group, oxetane group, and vinyl ether group; a cationic thermal polymerization initiator (B); a cationic photopolymerization initiator (C); and a stabilizer (D). The stabilizer (D) includes at least one of a surfactant (D1), an antioxidant (D2), or a resin modifier (D3). When the stabilizer (D) includes the surfactant (D1) in a proportion of X % by mass, the antioxidant (D2) in a proportion of Y % by mass, and the resin modifier (D3) in a proportion of Z % by mass, with respect to a total mass of the stabilizer (D), the proportion of the stabilizer (D) to 100 parts by mass of the resin (A) is less than or equal to (5.0×X+1.5×Y+20.0×Z)/100 parts by mass.

Dependencies are inferred from the claim text.