Back to results
US 2024/0400869 A1Published application
Hot melt sealants having low thermal conductivity
OwnerHarald Becker, Brian R. White +3inventors
InventorsHarald Becker, Brian R. White, Heike S. Bruecher, Oliver Kron, Dirk Raatz
Life of this patent
Estimating the term…
Abstract
The invention includes hot melt sealants having a low thermal conductivity in which the polymer component is maximized, and specialized fillers are not needed. The inventive sealants have found utility as thermoplastic spacers, edge seals and single seals.
Claims20
A hot melt sealant comprising:
- a. from 1% by weight to 30% by weight of a silane modified polymer,
- b. from 30% by weight to 65% by weight of a butene component,
- c. from 10% by weight to 34% by weight of carbon black,
- d. from 2% by weight to 20% by weight of a desiccant,
- wherein the hot melt sealant has a total polymer content of greater than 55% by weight.
2 more elements
A hot melt sealant comprising:
- a. from 2% by weight to 18% by weight of a silane modified polymer,
- b. from 35% by weight to 60% by weight of a butene component,
- c. from 15% by weight to 32% by weight of carbon black,
- d. from 3% by weight to 18% of a desiccant, wherein the hot melt sealant has a total polymer content of greater than 55% by weight and the carbon black makes up at least 70% by weight of the non-desiccant filler in the hot melt sealant.
1 more element
Dependencies are inferred from the claim text.