Mems device and method for manufacturing mems device

A MEMS device manufacturing method comprising:

• forming an oxide film on a surface of a device substrate;
• forming a through hole via which a surface of the device substrate is exposed by partially removing the oxide film;
• forming a bump stopper in a size larger than the through hole in a plan view, by laminating a conductive inorganic material in the through hole and on a part of the oxide film, the part surrounding the through hole;
• further covering the surface of the device substrate with a passivation layer;
• forming a mask by partially removing the passivation layer and the oxide film, the mask being larger in size than the bump stopper and covering at least the bump stopper, and having a shape corresponding to a sensor unit;
• performing structure etching in which the device substrate is removed by being etched using the mask to form a contour line of the sensor unit;
• and
• obtaining a sensor unit having a narrow bump stopper on a surface by removing the mask.

A MEMS device manufacturing method comprising:

• forming an oxide film on a surface of a device substrate;
• forming an opening via which a surface of the device substrate is exposed by partially removing the oxide film;
• laminating an inorganic material smaller than the opening, inside the opening;
• further covering the surface of the device substrate with a passivation layer;
• forming a mask by partially removing the passivation layer and the oxide film, and having a shape corresponding to the sensor unit;
• performing structure etching in which the device substrate is removed by being etched using the mask to form a contour line of the sensor unit and a contour line of the bump stopper simultaneously;
• and
• forming the sensor unit with a bump stopper having a same width on a surface, by removing the mask.