Adhesive guiding device, adhesive application device, and adhesive application method
AssigneeNitto Denko Corporation
InventorsAtsushi TAKASHIMA, Yosuke MAKIHATA
Life of this patent
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Abstract
In an adhesive material guiding apparatus, a nozzle configured to be disposed at a position facing an adherend as an object to be stuck is provided, and a path is configured such that a threadlike adhesive passes through a through hole formed in the nozzle. A braking member such as a top is disposed at an upstream side of the through hole of the nozzle. The braking member is configured such that at least one of the ease of sticking to the threadlike adhesive and a difficulty in slipping are superior to those of the through hole of the nozzle.
Claims16
An adhesive guiding apparatus having an adhesive path configured to allow an elongated adhesive to pass through in a longitudinal direction of the elongated adhesive, and capable of guiding at least a tip end portion of the elongated adhesive to a position facing a desired object to be stuck, the adhesive guiding apparatus comprising:
- a nozzle unit having a through hole forming a part of the adhesive path, and in which a tip end portion of the through hole is configured to be disposed at a position facing the object to be stuck;
- and
- a braking member disposed on an upstream side of the through hole of the nozzle unit on the adhesive path, wherein
- the braking member has a property that is superior to the nozzle unit in at least one of ease of sticking to the elongated adhesive and a difficulty in slipping.
Dependencies are inferred from the claim text.