Bonding for high-temperature composite applications
AssigneeRohr, Inc.
InventorsWEIMING LU, IWONA WROBEL, VIJAY V. PUJAR, KATHERINE E. WAUGH
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Abstract
A manufacturing method is provided. The manufacturing method applies a bonding adhesive to at least one of the first surface of the first composite preform component or the first surface of the second composite preform component, and joins the first surface of the first composite preform component to the first surface of the second composite preform component.
Claims20
A manufacturing method, comprising:
- applying a bonding adhesive to at least one of a first surface of a first composite preform component or a first surface of a second composite preform component;
- and
- joining the first surface of the first composite preform component to the first surface of the second composite preform component.
A manufacturing method, comprising:
- preparing at least one of a first surface of a first composite preform component or a first surface of a second composite preform component for joining;
- applying a bonding adhesive to the at least one of the first surface of the first composite preform component or the first surface of the second composite preform component;
- pressing the first surface of the first composite preform component and the first surface of the second composite preform component together to form a joined composite preform component;
- curing the joined composite preform component;
- heat treating the joined composite preform component;
- and
- performing either chemical vapor infiltration (CVI) densification or chemical vapor deposition (CVD) on the joined composite preform component.
A bonding adhesive for joining a first surface of a first composite preform component to a first surface of a second composite preform component, the bonding adhesive comprising:
- at least one of a high temperature capable bonding adhesive or a melt-resistant bonding adhesive;
- and
- at least one of a thermoset resin or a thermoplastic resin, wherein the thermoset resin is at least one of a phenolic-based resin, a polyimide-based resin, or a polybenzoxazine-based resin, wherein the thermoplastic resin is at least one of an isotropic pitch, mesophase pitch, polyetheretherketone (PEEK), or polyaryleetherketones (PAEK), and wherein the bonding adhesive is reinforced with at least one of chopped carbon fiber, carbon nanotubes, carbon nanofibers, graphene, or powdered diamond dust.
Dependencies are inferred from the claim text.