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US 2024/0399500 A1Published application
Laser processing apparatus
AssigneeDAIHEN Corporation
InventorRyoji Tamaki
Life of this patent
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Abstract
A laser processing apparatus includes: a laser-beam irradiation device that forms a processing groove in a workpiece by subjecting workpiece to laser processing while scanning a surface of workpiece; a nozzle that injects a gas W in a range of laser-beam irradiation by laser-beam irradiation device; a motor that changes a position of injection of gas W by nozzle; and a controller. Controller controls motor in accordance with a position of irradiation by laser-beam irradiation device, thereby changing the position of injection of gas W by nozzle.
Claims5
A laser processing apparatus comprising:
- a laser-beam irradiation device that forms a processing groove in a workpiece by subjecting the workpiece to laser processing while scanning a surface of the workpiece;
- an injection device that injects a gas in a range of laser-beam irradiation by the laser-beam irradiation device;
- an actuator that changes a position of injection of the gas by the injection device;
- and
- a controller, wherein
- the controller controls the actuator in accordance with a position of irradiation by the laser-beam irradiation device, thereby changing the position of injection of the gas by the injection device.
3 more elements
Dependencies are inferred from the claim text.