Method of segmented electroplating gold finger
AssigneeGold Circuit Electronics Ltd.
InventorChen-Tse Yang
Life of this patent
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Abstract
A method of a segmented electroplating golden finger includes a substrate, which is drilled and plated, and including: a. first etching, forming circuit patterns and gold finger parts on the substrate, the gold finger part is composed of several mutually independent gold fingers, a lead channel is provided between the two adjacent gold fingers, and a side lead connected to each gold finger is arranged on the lead channel; b. solder resist, solder resist protection for the etched substrate; c. the gold fingers partly covered with a wet film; d. parallel exposure to perform image transfer; e. gold finger electroplating; f. adhesive glue; g. second etching, removing the leads, completing a finished product.
Claims6
A method of a segmented electroplating gold finger, comprising a substrate, which is drilled and electroplated, wherein the method of the segmented electroplating gold finger comprises:
- a. first etching, forming circuit patterns and gold finger parts on the substrate, wherein the gold finger part is composed of several mutually independent gold fingers, a lead channel is provided between the two adjacent gold fingers, and a side lead connected to each of the gold fingers is arranged on the lead channel;
- b. solder resist, performing solder resist protection on the etched substrate;
- c. the gold fingers partly covered with a wet film;
- d. parallel exposure to perform image transfer;
- e. gold finger electroplating;
- f. an adhesive glue to protect the gold finger and a circuit that is required to be retained;
- g. second etching, removing the side lead, and completing a finished product.
Dependencies are inferred from the claim text.