Method for fabricating embedded silicon photonics chip in a multi-die package

A method comprising:

• providing a base substrate structure having a top surface and conductive regions disposed in a dielectric region at the top surface, the conductive regions being electrically connected to an interconnect structure;
• forming a first die having a first surface and a second surface opposite to each other, forming the first die comprising:
• forming a photonic device on a first substrate of the first die, wherein the photonic device comprises a waveguide section;
• forming a first interconnect structure at the first surface of the first die;
• forming a second interconnect structure at a side surface of the first die;
• and
• removing a portion of the first substrate from a back side of the first die to expose the waveguide section at the second surface of the first die;
• and
• bonding the first die sideways to the base substrate structure, wherein the side surface of the first die is bonded to the top surface of the base substrate structure, and the first surface of the first die is perpendicular to the top surface of the base substrate structure.

A method comprising:

• providing a base substrate structure having a top surface and conductive regions disposed in a dielectric region at the top surface, the conductive regions being electrically connected to an interconnect structure disposed in the base substrate structure;
• providing a first die having a first surface and a second surface opposite to each other;
• forming a photonic device on a first substrate of the first die, wherein the photonic device comprises a waveguide section;
• forming a first interconnect structure at the first surface of the first die;
• forming a second interconnect structure at a side surface of the first die;
• removing a portion of the first substrate from a back side of the first die to expose the waveguide section at the second surface of the first die;
• and
• bonding the first die sideways to the base substrate structure, wherein the side surface of the first die is bonded to the top surface of the base substrate structure, and the first surface of the first die is perpendicular to the top surface of the base substrate structure.