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US 2024/0393549 A1Published application
Optical Device and Method of Manufacture
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTung-Liang Shao, Yu-Sheng Huang, Tsung-Fu Tsai, Chen-Hua Yu
Life of this patent
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Abstract
Optical devices and methods of manufacture are presented in which an optical device and other devices such as laser dies are attached prior to bonding of the optical device and laser die to other device. The optical device and laser die are separated by no more than about 10 μm.
Claims20
A method of manufacturing an optical device, the method comprising:
- placing a first optical chiplet;
- placing a laser die separated from the first optical chiplet by no more than about 10 μm, to form a photonic chiplet integration;
- and
- placing the photonic chiplet integration to a substrate.
1 more element
A method of manufacturing an optical device, the method comprising:
- attaching a first optical chiplet to a first chuck;
- attaching a laser die to a second chuck;
- moving at least one of the first chuck and the second chuck to align an edge coupler of the first optical chiplet with an output of the laser die;
- and
- dispensing a first glue between the first optical chiplet and the laser die, wherein after the dispensing the first glue, the first glue has a first thickness less than about 10 μm.
2 more elements
An optical device comprising:
- a first optical chiplet;
- and
- a laser die adjacent to the first optical chiplet, wherein a first distance between the laser die and the first optical chiplet is less than about 10 μm.
Dependencies are inferred from the claim text.