US 2024/0393384 A1 · SEMICONDUCTOR FAULT ANALYSIS DEVICE AND SEMICONDUCTOR FAULT ANALYSIS METHOD

Abstract

A control part of a semiconductor fault analysis device outputs an alignment command that moves a chuck to a position at which a target is detectable by a first optical detection part and then aligns an optical axis of a second optical system with an optical axis of a first optical system with the target as a reference, and outputs an analysis command that applies a stimulus signal to a semiconductor device and receives light from the semiconductor device emitted according to a stimulus signal with at least one of a first optical detection part and a second optical detection part in a state in which a positional relationship between the optical axis of the first optical system and the optical axis of the second optical system is maintained.

Claims26

Dependent claims

A semiconductor fault analysis device comprising:

a first analysis part in which a first optical detection part receives light emitted by a semiconductor device via a first optical system, and the first optical system is moved relative to the semiconductor device by a first drive part;
a second analysis part in which a second optical detection part receives light emitted by the semiconductor device via a second optical system, and the second optical system is moved relative to the semiconductor device by a second drive part;
a device arrangement part having a chuck disposed between the first analysis part and the second analysis part to hold the semiconductor device, the chuck being moved relative to the first analysis part and the second analysis part;
a stimulus signal application part configured to apply a stimulus signal to the semiconductor device;
and
a control part configured to output a command to the first analysis part, the second analysis part, the device arrangement part, and the stimulus signal application part,
wherein the control part outputs an alignment command that outputs an analysis command that applies a stimulus signal to the semiconductor device and receives light from the semiconductor device emitted according to the stimulus signal with at least one of the first optical detection part and the second optical detection part, the second analysis part, the stimulus signal application part, and the device arrangement part.

4 more elements

A semiconductor fault analysis device comprising:

a first analysis part configured to irradiate a semiconductor device with light generated by a first light source via a first optical system having a first optical scanning part;
a second analysis part configured to irradiate the semiconductor device with light generated by a second light source via a second optical system having a second optical scanning part;
a device arrangement part having a chuck disposed between the first analysis part and the second analysis part to hold the semiconductor device, the chuck being moved relative to the first analysis part and the second analysis part;
an electrical signal acquisition part configured to receive an electrical signal output by the semiconductor device;
and
a control part configured to output a command to the first analysis part, the second analysis part, the device arrangement part, and the electrical signal acquisition part,
wherein the control part outputs an analysis command that irradiates the semiconductor device with light from at least one of the first analysis part and the second analysis part and receives an electrical signal from the semiconductor device by the electrical signal acquisition part to the first analysis part, the second analysis part, the electrical signal acquisition part, and the device arrangement part.

4 more elements

A semiconductor fault analysis device comprising:

a first analysis part in which a semiconductor device is irradiated with light generated by a first light source via a first optical system having a first optical scanning part, and a first optical detection part receives first response light from the semiconductor device generated according to the light of the first light source;
a second analysis part in which the semiconductor device is irradiated with light generated by a second light source via a second optical system having a second optical scanning part, and a second optical detection part receives second response light from the semiconductor device generated according to the light of the second light source;
a device arrangement part having a chuck disposed between the first analysis part and the second analysis part to hold the semiconductor device and the chuck being moved relative to the first analysis part and the second analysis part;
a stimulus signal application part configured to apply a stimulus signal to the semiconductor device;
and
a control part configured to output a command to the first analysis part, the second analysis part, the device arrangement part, and the stimulus signal application part, and
wherein the control part outputs an alignment command that outputs an analysis command that irradiates the semiconductor device with light from at least one of the first analysis part and the second analysis part and receives at least one of the first response light and the second response light from the semiconductor device with at least one of the first optical detection part and the second optical detection part in the stimulus signal is applied to the semiconductor device to the first analysis part, the second analysis part, the stimulus signal application part, and the device arrangement part.

4 more elements

A semiconductor fault analysis method using a semiconductor fault analysis device for analyzing a semiconductor device, the semiconductor fault analysis device comprising:

a first analysis part in which a first optical detection part receives light emitted by a semiconductor device via a first optical system, and the first optical system is moved relative to the semiconductor device by a first drive part;
a second analysis part in which a second optical detection part receives light emitted by the semiconductor device via a second optical system, and the second optical system is moved relative to the semiconductor device by a second drive part;
a device arrangement part having a chuck disposed between the first analysis part and the second analysis part to hold the semiconductor device, the chuck being moved relative to the first analysis part and the second analysis part;
a stimulus signal application part configured to apply a stimulus signal to the semiconductor device;
and
a control part configured to output a command to the first analysis part, the second analysis part, the device arrangement part, and the stimulus signal application part,
wherein the semiconductor fault analysis method includes a step of applying the stimulus signal to the semiconductor device, and a step of receiving light from the semiconductor device emitted according to the stimulus signal by at least one of the first optical detection part and the second optical detection part.

4 more elements

A semiconductor fault analysis method using a semiconductor fault analysis device for analyzing a semiconductor device, the semiconductor fault analysis device comprising:

a first analysis part configured to irradiate a semiconductor device with light generated by a first light source via a first optical system having a first optical scanning part;
a second analysis part configured to irradiate the semiconductor device with light generated by a second light source via a second optical system having a second optical scanning part;
a device arrangement part having a chuck disposed between the first analysis part and the second analysis part to hold the semiconductor device, the chuck being moved relative to the first analysis part and the second analysis part;
an electrical signal acquisition part configured to receive an electrical signal output by the semiconductor device;
and
a control part configured to output a command to the first analysis part, the second analysis part, the device arrangement part, and the electrical signal acquisition part,
wherein the semiconductor fault analysis method comprises a step of irradiating the semiconductor device with light from at least one of the first analysis part and the second analysis part, and a step of receiving an electrical signal from the semiconductor device by the electrical signal acquisition part.

4 more elements

A semiconductor fault analysis method using a semiconductor fault analysis device for analyzing a semiconductor device, the semiconductor fault analysis device comprising:

a first analysis part in which a semiconductor device is irradiated with light generated by a first light source via a first optical system having a first optical scanning part, and a first optical detection part receives first response light from the semiconductor device generated according to the light of the first light source;
a second analysis part in which the semiconductor device is irradiated with light generated by a second light source via a second optical system having a second optical scanning part, and a second optical detection part receives second response light from the semiconductor device generated according to the light of the second light source;
a device arrangement part having a chuck disposed between the first analysis part and the second analysis part to hold the semiconductor device and the chuck being moved relative to the first analysis part and the second analysis part;
a stimulus signal application part configured to apply a stimulus signal to the semiconductor device;
and
a control part configured to output a command to the first analysis part, the second analysis part, the device arrangement part, and the stimulus signal application part, and
wherein the semiconductor fault analysis method includes a step of irradiating the semiconductor device with light from at least one of the first analysis part and the second analysis part in a state in which the stimulus signal is applied to the semiconductor device, and a step of receiving at least one of the first response light and the second response light from the semiconductor device by at least one of the first optical detection part and the second optical detection part.

4 more elements

Dependencies are inferred from the claim text.

Semiconductor fault analysis device and semiconductor fault analysis method

Life of this patent

Semiconductor fault analysis device and semiconductor fault analysis method

Life of this patent

Abstract

Claims26