Heat treatment apparatus, method of maintaining heat treatment apparatus, and method of regenerating lamp sleeve
AssigneeGlobalwafers Japan Co., Ltd.
InventorsHaruo SUDO, Tatsuhiko AOKI, Manabu KATO
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AssigneeGlobalwafers Japan Co., Ltd.
InventorsHaruo SUDO, Tatsuhiko AOKI, Manabu KATO
Estimating the term…
The timing for removing granular SiOx deposits on an inner wall of a lamp sleeve is easily obtained to prevent a decrease in production efficiency and suppress an increase in power consumption for heat treatment. A heat treatment apparatus includes a plurality of lamps that heats a semiconductor substrate, a lamp sleeve that reflects irradiation light of the plurality of lamps; a power supply that applies a lamp voltage to the plurality of lamps; a temperature detector that detects a temperature of the semiconductor substrate, a controller that controls the lamp voltage or lamp current applied to the plurality of lamps, and a warning unit that makes a warning on timing for cleaning the lamp sleeve through a display or a voice. The controller causes the warning unit to issue a warning when the lamp voltage or lamp current applied to the plurality of lamps exceeds a predetermined threshold.
A heat treatment apparatus, comprising:
Dependencies are inferred from the claim text.