Pattern forming method and article manufacturing method
AssigneeCanon Kabushiki Kaisha
InventorTOSHIKI ITO
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Abstract
A pattern forming method is provided. A thickness of a residual film sandwiched between a most projecting portion of a pattern of the mold and the substrate is not less than 50 nm, and a height difference of the unevenness of the mold is not more than the thickness of the residual film. The method includes a forming step of forming an inversion layer on unevenness transferred from the mold onto a cured film, a removing step of removing an upper layer portion of the inversion layer such that a top surface of a convex portion of the unevenness formed on the cured film is exposed, and an etching step of, using the inversion layer buried in the concave portion as a mask, etching the cured film up to a surface of the substrate to form an inverted pattern.
Claims9
A pattern forming method comprising:
- an arranging step of arranging, on a substrate, a curable composition (A) containing at least a polymerizable compound (a);
- a contact step of, after the arranging step, bringing the curable composition (A) on the substrate into contact with a mold having unevenness;
- a curing step of, after the contact step, curing the curable composition (A) to form a cured film;
- and
- a separation step of, after the curing step, separating the curable composition (A) and the mold, characterized in that
- a thickness of a residual film sandwiched between the substrate and a most projecting portion of the concave-convex pattern of the mold is not less than 50 nm, and a height difference of the unevenness of the mold is not more than the thickness of the residual film, and
- the pattern forming method further comprises:
- a forming step of forming an inversion layer on unevenness transferred from the mold onto the cured film;
- a removing step of, in a state in which the inversion layer is buried in a concave portion of the unevenness formed on the cured film, removing an upper layer portion of the inversion layer such that a top surface of a convex portion of the unevenness formed on the cured film is exposed;
- and
- an etching step of, using the inversion layer buried in the concave portion as a mask, etching the cured film up to a surface of the substrate to form an inverted pattern.
Dependencies are inferred from the claim text.