High thermal conductivity, low thermal expansion composites
AssigneeThe Research Foundation for The State University of New York
InventorsScott N. Schiffres, Arad Azizi
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AssigneeThe Research Foundation for The State University of New York
InventorsScott N. Schiffres, Arad Azizi
Estimating the term…
Additively manufactured non-metal particle and metal matrix composites are provided. An intermetallic compound interface layer, e.g., metal carbide, is formed between the non-metal particle, e.g., diamond, and the metal matrix, that enhances thermal transfer. One application of this is to form thermal management structures with high thermal conductivity via laser powder bed fusion. A powder material for additively manufacturing a structure, comprising metal particles; and non-metallic particles with thermal conductivities greater than 100 W/m-K and coefficient of thermal expansion less than 10 ppm/degree C., wherein the metal particles are fusible with heat to form a heterogeneous solid structure around the non-metallic particles with an intermetallic compound interface, the heterogeneous solid structure having enhanced thermal conductivity and lower coefficient of thermal expansion with respect to a homogeneous specimen of the fused metal particles alone.
A powder material for additively manufacturing a structure, comprising:
A method for fabrication metal structures, comprising:
A heatsink, formed of a heterogeneous material comprising:
Dependencies are inferred from the claim text.