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US 2024/0390891 A1Published application
Microchannel chip
AssigneeSumitomo Bakelite Co., Ltd.
InventorKosuke Yakumaru
Life of this patent
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Abstract
A microchannel chip (1) includes a resin substrate (2) manufactured using a mold formed by direct engraving, and including a channel groove (21) on one surface of the resin substrate (2); and a covering material (3) joined to the resin substrate (2) to cover the channel groove (21). In the resin substrate (2), the roundness of a corner (2c) formed at a boundary between a joint surface (2a) to the covering material (3) and an inner surface (2b) defining the channel groove (21) is R5 μm or less.
Claims4
A microchannel chip comprising:
- a resin substrate manufactured using a mold formed by direct engraving, and including a channel groove on one surface of the resin substrate;
- and
- a covering material joined to the resin substrate to cover the channel groove,
- wherein in the resin substrate, a roundness of a corner formed at a boundary between a joint surface to the covering material and an inner surface defining the channel groove is R5 μm or less.
1 more element
Dependencies are inferred from the claim text.