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US 2024/0387115 A1Published application
High power density capacitor
AssigneeWeinberg Medical Physics LLC
InventorsIrving N. WEINBERG, Lamar Odell MAIR
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Abstract
An apparatus and method of making the apparatus are provided having a plurality stacked undulating layers having an undulation pattern forming a patterned capacitor. At least one of the plurality of layers includes sublayers of dielectric material materials and electrically conducting materials.
Claims20
An apparatus comprising:
- a plurality of sub-capacitors, at least one of which having an undulation or perforation pattern, wherein the apparatus forms a capacitor, and
- at least one of the plurality of sub-capacitors includes at least one sublayer of dielectric material and at least one electrically conducting material.
A method for manufacturing a patterned capacitor comprising
- embossing layers of conductors and insulators,
- forming stacks of the layers via the sequential application of pressure, applied over a 3D printed shape-defined mold having an undulation pattern.
An apparatus for manufacturing a patterned capacitor comprising:
- at least one pressure controlled motorized embossing tool configured to press an embossing mold into a film surface for patterning films, wherein the apparatus is used to sequentially stack material films layer by layer for forming a capacitor.
A method for manufacturing a patterned capacitor comprising:
- assembling perforated conducting materials into sub-capacitors by successively and partially coating the perforated conducting materials with electrolyte and additional conducting materials, wherein the sub-capacitors are assembled into a capacitor.
Dependencies are inferred from the claim text.