Processing tool
AssigneeDisco Corporation
InventorYuki AKAHOSHI
Life of this patent
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Abstract
A processing tool for removing a chamfer of a wafer that is formed on its front surface with a central region and a peripheral surplus region, the chamfer being formed in the peripheral surplus region. The processing tool includes an annular grinding grindstone with an opening into which a spindle is inserted and having first and second side surfaces and a polishing grindstone formed on at least one of the first side surface or the second side surface. The processing tool is formed in such a manner as to satisfy both the following conditions (1) and (2): H + h > L ( 1 ) L / 3 > h > L / 100 ( 2 ) where L is a length in a radial direction from a peripheral end of the chamfer to be removed, H is a width of the grinding grindstone, and h is a width of the polishing grindstone.
Claims4
A processing tool for removing a chamfer of a wafer that is formed on its front surface with a central region and a peripheral surplus region surrounding the central region, the chamfer being formed in a periphery of the peripheral surplus region, the processing tool comprising:
- an annular grinding grindstone having in its center an opening into which a spindle is inserted and having a first side surface and a second side surface;
- and
- a polishing grindstone formed on at least one of the first side surface or the second side surface,
- wherein the processing tool is formed in such a manner as to satisfy both the following conditions (1) and (2):
- H
- +
- h
- >
- L
- (
- 1
- )
- L
- /
- 3
- >
- h
- >
- L
- /
- 100
- (
- 2
- )
- where L is a length in a radial direction from a peripheral end of the chamfer to be removed, H is a width of the grinding grindstone, and h is a width of the polishing grindstone.
Dependencies are inferred from the claim text.