Wafer conveyance device

Abstract

Provided is a wafer conveyance device that suppresses a temperature rise of gas in a wafer conveyance chamber. A wafer conveyance device for conveying a wafer between a FOUP (Front-Opening Unified Pod) in which the wafer is stored and a processing device for processing the wafer, the wafer conveyance device including a wafer conveyance chamber in which a conveyance robot is installed, an FFU chamber communicating with the wafer conveyance chamber, a return duct provided in a wall or a door of the wafer conveyance chamber and communicating with both the wafer conveyance chamber and the FFU room, a blowing fan that blows gas from the FFU chamber into the wafer conveyance chamber, and a heat exchanger that cools the gas circulating in an internal space including the FFU chamber, the return duct, and the wafer conveyance chamber.

Dependencies are inferred from the claim text.