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US 2024/0376353 A1Published application
Two-component structural adhesive
AssigneeDdp Specialty Electronic Materials US, LLC
InventorsFelix Koch, Daniel Schneider, Beda Steiner
Life of this patent
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Abstract
Provided herein is a two-component adhesive composition showing excellent adhesive strength after heat and humidity exposure.
Claims29
A two-component epoxy adhesive composition comprising:
- Component A comprising:
- ai) at least one epoxy resin;
- and
- aii) a reactive toughener made by reacting at least one polyol selected from poly(alkylene oxide)diol, and poly(butadiene)diol with a polyisocyanate in the presence of a polyurethane catalyst, optionally followed by chain extension with a di-phenol, and end-capping with a molecule of Formula I:
- where R1 and R2 are independently selected from hydrogen and C1 to C6 alkyl, n is an integer from 1 to 2, and R3 is C1 to C6 alkyl;
- and
- Component B comprising:
- bi) one or more polyamines;
- bii) optionally one or more latent epoxy curing agents;
- and
- biii) one or more epoxy curing catalysts.
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Dependencies are inferred from the claim text.