Pressure-sensitive adhesive sheet for temporarily fixing electronic component and method for treating electronic component

Abstract

Provided is a pressure-sensitive adhesive sheet to be subjected to temporary fixing of an electronic part to a support, the pressure-sensitive adhesive sheet being capable of exhibiting peelability from the support through irradiation with laser light, and reducing a residue on the support after its peeling. A pressure-sensitive adhesive sheet for temporarily fixing an electronic part of the present invention includes: a photothermal conversion layer; and a thermal decomposition layer directly arranged on the photothermal conversion layer. A 5% weight loss temperature of the thermal decomposition layer after UV irradiation is lower than a 5% weight loss temperature of the photothermal conversion layer after UV irradiation.

Dependencies are inferred from the claim text.