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US 2024/0376238 A1Published application
Dual-cure resin for preparing chemical mechanical polishing pads
AssigneeCMC Materials, Inc.
InventorAchla Khanna
Life of this patent
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Abstract
A dual-cure resin formulation having an improved pot life is described. The dual cure resin may be used to fabricate a CMP pad using a 3D printing process.
Claims15
A formulation for preparing a chemical-mechanical polishing pad via photopolymerization and heating, the formulation comprising:
- a first component comprising:
- one or more acrylate-capped oligomers;
- one or more acrylate monomers;
- and
- at least one photoinitiator;
- and
- a second component comprising one or more thermal curatives.
4 more elements
Dependencies are inferred from the claim text.