Multilayer fluidic devices and methods for their fabrication
AssigneeIllumina, Inc.
InventorsJeffrey S. Fisher, John A. Moon, Bala Murali Venkatesan
Life of this patent
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Abstract
A fluidic device including an inorganic solid support attached to an organic solid support by a bonding layer, wherein the inorganic solid support has a rigid structure and wherein the bonding layer includes a material that absorbs radiation at a wavelength that is transmitted by the inorganic solid support or the organic solid support; and a channel formed by the inorganic solid support and the organic solid support, wherein the bonding layer that attaches the inorganic solid support to the organic solid support provides a seal against liquid flow. Methods for making fluidic devices, such as this, are also provided.
Claims39
A method for making a multilayer device, comprising
- (a) providing an inorganic solid support and an organic solid support, wherein the inorganic solid support comprises a rigid structure and electrically conductive features present at a location corresponding to a fluidic channel and absent from a surface area that bonds to the organic solid support;
- (b) providing a radiation-absorbing material, wherein the radiation-absorbing material is not a metal;
- (c) contacting the inorganic solid support, the organic solid support, and the radiation-absorbing material in a configuration wherein the radiation-absorbing material is present at an interface between the surface area of the inorganic solid support and the organic solid support;
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- (d) applying compression at the interface and irradiating the radiation-absorbing material with radiation to form a bonding layer between the inorganic solid support and the organic solid support, wherein the organic solid support defines walls of the fluidic channel.
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A fluidic device, comprising
- (a) an inorganic solid support attached to an organic solid support by a bonding layer between the inorganic solid support and the organic solid support, wherein the bonding layer includes at least a portion of the inorganic solid support or the organic solid support, wherein the at least a portion of the inorganic solid support or the organic solid support is resolidified after having been melted, wherein the inorganic solid support has a rigid structure and wherein the bonding layer comprises a material that absorbs radiation at a wavelength that is transmitted by the inorganic solid support or the organic solid support, wherein the material that absorbs the radiation is not a metal;
- (b) at least one fluidic channel formed by the attachment of the inorganic solid support to the organic solid support, wherein the channel is configured to contain a liquid and the bonding layer that attaches the inorganic solid support to the organic solid support provides a seal against liquid leakage;
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- (c) electrically conductive features present at a location corresponding to the at least one fluidic channel.
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Dependencies are inferred from the claim text.