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US 2024/0368322 A1Published application
Thermosetting composition, method for producing molded article using the same, and cured product
AssigneeIdemitsu Kosan Co., Ltd.
InventorsYutaka OBATA, Yasunari OKADA, Katsuki ITO, Kazuki WATANABE
Life of this patent
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Abstract
A thermosetting composition comprising: (A) a compound represented by the formula (A2) or (A3), (B) a thermal polymerization initiator, and (E) an inorganic filler.
Claims17
A thermosetting composition comprising:
- (A) a compound represented by the following formula (A2) or (A3),
- (B) a thermal polymerization initiator:
- and
- (E) an inorganic filler:
- wherein in the formula (A2),
- R111 and R115 independently represent a hydrogen atom or a methyl group,
- R112 represents an alkylene group including 1 to 20 carbon atoms,
- R113 and R114 independently represent an alkylene group including 1 to 30 carbon atoms,
- n112 represents an integer of 0 or 1, and
- n113 represents an integer of 0 to 30.
- wherein in the formula (A3),
- R121 represents an alkylene group including 1 to 6 carbon atoms,
- R122 represents a hydrogen atom or a methyl group,
- n120 represents 3 or 4,
- n121 represents an integer of 0 to 15,
- when n120 is 3, Z120 represents a substituted or unsubstituted trivalent aliphatic hydrocarbon group including 3 to 10 carbon atoms, and
- when n120 is 4, Z120 represents a substituted or unsubstituted tetravalent aliphatic hydrocarbon group including 5 to 10 carbon atoms.
14 more elements
Dependencies are inferred from the claim text.