Injection molding method for manufacturing packaging structure, packaging structure, and camera module
AssigneeRayprus Technology (Foshan) Co., Ltd.
InventorHSIN-YEN HSU
Life of this patent
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Abstract
An injection molding method which can isolate injection materials from flowing into the sensing area includes: providing an injection mold comprising a first mold and a second mold; placing a component to be packaged on the second mold; arranging a sealant on a non-sensing area of the component to be packaged; placing the first mold on the component to be packaged; injecting a molding material and curing the molding material to form an encapsulation portion; removing the injection mold. A packaging structure and a camera module carrying it are also disclosed.
Claims20
An injection molding method for manufacturing a packaging structure, comprising:
- providing an injection mold, wherein the injection mold comprises a first mold and a second mold, the first mold comprises a body portion, the body portion defines a groove, the groove is provided with at least one protrusion, and the at least one protrusion divides the groove into a plurality of cavities;
- placing a component to be packaged on the second mold, wherein the component to be packaged comprises a substrate and an optoelectronic element fixed on the substrate, and the optoelectronic element comprises a sensing area and a non-sensing area surrounding the sensing area;
- applying a sealant on the non-sensing area, and the sealant surrounding the sensing area;
- placing the first mold on the component to be packaged, causing the protrusion to abut against the sealant and the plurality of cavities to cover the non-sensing area;
- injecting an injection material into the plurality of cavities, curing the injection material to form an encapsulation portion on the non-sensing area and the substrate;
- and
- removing the first mold and the second mold to obtain the packaging structure.
A packaging structure comprising:
- a substrate;
- an optoelectronic element arranged on and electrically connected to the substrate, the optoelectronic element comprising a sensing area and a non-sensing area surrounding the sensing area;
- a sealant formed on the non-sensing area and surrounding the sensing area;
- and
- an encapsulation portion covering the non-sensing area and the substrate and connecting to the sealant.
A camera module comprising:
- a packaging structure, the packaging structure comprising:
- a substrate;
- a photosensitive chip arranged on and electrically connected to the substrate, the photosensitive chip comprising a sensing area and a non-sensing area surrounding the sensing area;
- a sealant formed on the non-sensing area and surrounding the sensing area;
- and
- an encapsulation portion covering the non-sensing area and the substrate and connecting to the sealant.
Dependencies are inferred from the claim text.