Method of manufacturing laminate and kit of adhesive compositions

A method of manufacturing a laminate that includes a semiconductor substrate, a light-transmissive support substrate, and an adhesive layer and a release layer provided between the semiconductor substrate and the support substrate, and is used for peeling the semiconductor substrate and the support substrate after the release layer absorbs light irradiated from a side of the support substrate, the method comprising:

• forming a first adhesive coating layer on a surface of a release agent coating layer formed on a surface of the support substrate;
• forming a second adhesive coating layer on a surface of the semiconductor substrate;
• and
• bonding the first adhesive coating layer and the second adhesive coating layer, followed by heating, to form the release layer from the release agent coating layer, and form the adhesive layer from the first adhesive coating layer and the second adhesive coating layer, wherein
• the first adhesive coating layer is formed from a first adhesive composition,
• the second adhesive coating layer is formed from a second adhesive composition, and
• the first adhesive composition and the second adhesive composition satisfy the following (1) or (2):
• (1):
• the first adhesive composition contains a first thermosetting component, and a second thermosetting component that reacts with the first thermosetting component in the presence of a catalyst, and the second adhesive composition contains the catalyst;
• and
• (2):
• the second adhesive composition contains a first thermosetting component, and a second thermosetting component that reacts with the first thermosetting component in the presence of a catalyst, and the first adhesive composition contains the catalyst.