Material For Forming Organic Film, Substrate For Manufacturing Semiconductor Device, Method For Forming Organic Film, Patterning Process, And Compound

A material for forming an organic film, comprising:

• a compound for forming an organic film (A) represented by the following general formula (1A);
• and
• an organic solvent (B),
• wherein Y represents an n1-valent organic group, a trivalent nitrogen atom, or a tetravalent carbon atom;
• n1 represents an integer of 3 to 8;
• and X represents a partial structure represented by the following general formula (1B),
• wherein a broken line represents an attachment point;
• R1 and R2 represent a halogen atom, an alkyl group having 1 to 4 carbon atoms, an alkyloxy group having 1 to 4 carbon atoms, an alkynyl group having 2 to 4 carbon atoms, or an alkenyl group having 2 to 4 carbon atoms, a hydrogen atom on a carbon atom to constitute the alkyl group, the alkyloxy group, the alkynyl group, and the alkenyl group may be substituted with a fluorine atom, and aromatic rings optionally substituted with R1 may form a cross-linked structure with a single bond or via a divalent group obtained by removing one hydrogen atom from the R1;
• n4 and n5 represent an integer of 0 to 2;
• Ar1 and Ar2 each represent a benzene ring or a naphthalene ring;
• n2 represents 0 or 1;
• n3 represents 1 or 2;
• and R3 represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkynyl group having 2 to 4 carbon atoms, or an alkenyl group having 2 to 4 carbon atoms.