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AssigneeApplied Materials, Inc.
InventorsZhepeng CONG, Ashur J. ATANOS, Nimrod SMITH, Tao SHENG
Estimating the term…
Embodiments of the disclosure provided herein include an apparatus and method for lamp heating in process chambers used to process semiconductor substrates. The apparatus includes a lamp for use in a processing chamber, the lamp having a lamp envelope with an interior volume, a first end of the lamp envelope coupled to a base, a second end of the lamp envelope opposing the first end, a filament disposed within the interior volume, and a radiation shield proximate to the second end. In another embodiment, the lamp assembly has at least one lamp, the at least one lamp having a lamp envelope having an interior volume, a first end of the lamp envelope coupled to a base, a second end of the lamp envelope opposing the first end, a filament disposed within the interior volume, and a radiation shield proximate to the second end.
A lamp for use in a processing chamber, comprising:
A lamp assembly for use in a processing chamber, comprising:
A substrate processing system, comprising:
Dependencies are inferred from the claim text.