Method for processing substrates, in particular wafers, masks or flat panel displays, with a semi-conductor industry machine
AssigneeIntegrated Dynamics Engineering GmbH
InventorAndreas BIRKNER
Life of this patent
Estimating the term…
Abstract
A method for processing substrates, in particular wafers, masks or flat panel displays, with a semi-conductor industry machine, wherein a computer-supported process is used to determine the presence and/or position and/or orientation of the substrate. Further, a system designed to execute the method. The computer-supported process includes an artificial neural network.
Claims11
A method for monitoring or controlling handling systems, comprising:
- providing a robot, a moving element, robot arm, an end effector, a positioning unit, or any combination thereof, having means for gripping, transporting and/or depositing a substrate;
- capturing, with an artificial neural network of a processing unit, at least one image in a digitized form depicting a location in or on the handling system or in the environment of the handling system;
- analyzing, with the artificial neural network, the at least one image;
- and
- generating, with the artificial neural network, an information data set and/or a control command;
- wherein the processing unit uses the information data set and/or the control command for:
- directly controlling the robot, the moving element, the robot arm, the end effector, the positioning unit, or any combination thereof;
- supportively controlling the robot, the moving element, the robot arm, the end effector, the positioning unit, or any combination thereof;
- aligning the robot, the moving element, the robot arm, the end effector, the positioning unit, or any combination thereof;
- training the robot, the moving element, the robot arm, the end effector, the positioning unit, or any combination thereof;
- monitoring the robot, the moving element, the robot arm, the end effector, the positioning unit, or any combination thereof;
- or
- any combination thereof.
A handling system or machine for processing substrates including semiconductor wafers, masks, flat panel displays, or any combination thereof, the handling system or machine comprising:
- a semi-conductor industry machine, a robot, a moving element, a robot arm an end effector, a positioning unit, or any combination thereof;
- a processing unit including at least one trained artificial neural network;
- and
- an acquisition unit for capturing at least one image;
- wherein the artificial neural network of the processing unit:
- captures at least one image in a digitized form depicting a location in or on the handling system or in the environment of the handling system;
- analyzes the at least one image;
- and
- generates an information data set and/or a control command;
- and
- wherein the processing unit uses the information data set and/or the control command to:
- directly control the robot arm, the end effector, the positioning unit, or any combination thereof;
- supportively control the robot arm, the end effector, the positioning unit, or any combination thereof;
- align the robot arm, the end effector, the positioning unit, or any combination thereof;
- train the robot arm, the end effector, the positioning unit, or any combination thereof;
- monitor the robot arm, the end effector, the positioning unit, or any combination thereof;
- pass on to a higher-level control system;
- pass on to a user who draws conclusions from this information for his actions operating the handling system or machine;
- pass this information to control systems or other users;
- save for later or further evaluation;
- or
- any combination thereof.
Dependencies are inferred from the claim text.