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US 2024/0357735 A1Published application
Flexible printed circuit board having overcurrent protection function
AssigneeLG Energy Solution, Ltd.
InventorYoung Joong KIM
Life of this patent
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Abstract
Discussed is a flexible printed circuit board for overcurrent protection including a deformation layer formed between a first adhesive layer and a first polyimide layer or on the first polyimide layer. The deformation layer can include a shape memory material configured to be deformed in a certain predetermined direction at a predetermined temperature or higher.
Claims14
A flexible printed circuit board for overcurrent protection and including a soldering unit joined to one side of a printed circuit board by a solder, the flexible printed circuit board comprising:
- a foil layer having a circuit pattern formed thereon;
- a first adhesive layer formed on the foil layer;
- a second adhesive layer formed under the copper foil layer;
- a first polyimide layer formed on the first adhesive layer;
- a second polyimide layer formed under the second adhesive layer;
- and
- a deformation layer formed between the first adhesive layer and the first polyimide layer or on the first polyimide layer,
- wherein the deformation layer includes a shape memory material configured to be deformed in a predetermined direction at a predetermined temperature or higher.
5 more elements
Dependencies are inferred from the claim text.