Back to results
US 2024/0355582 A1Published application
Method for prefixing of substrates
AssigneeEV Group E. Thallner GmbH
InventorFriedrich Paul Lindner
Life of this patent
Estimating the term…
Abstract
A method and a device for prefixing substrates, whereby at least one substrate surface of the substrates is amorphized in at least one surface area, characterized in that the substrates are aligned and then make contact and are prefixed on the amorphized surface areas.
Claims14
A method for prefixing first and second substrates, the method comprising:
- amorphizing at least one substrate surface of the first and second substrates in at least one surface area;
- aligning the first and second substrates;
- and
- contacting the first and second substrates on the amorphized surface areas, thereby prefixing the first substrate to the second substrate,
- wherein an entirety of the substrate surface of the first substrate is prefixed to an entirety of the substrate surface of the second substrate.
2 more elements
A device for prefixing first and second substrates, the device comprising:
- an amorphization system configured to amorphized at least one substrate surface of the first and second substrate in at least one surface area;
- an alignment system configured to align the first and second substrates;
- and
- a prefixing system configured to prefix the first substrate to the second substrate by contacting the first and second substrates on the amorphized surface areas, the prefixing system being further configured to prefix an entirety of the substrate surface of the first substrate to an entirety of the substrate surface of the second substrate.
1 more element
Dependencies are inferred from the claim text.