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US 2024/0352245 A1Published application
Resin composition for three-dimensional photoshaping
AssigneeNagase Chemtex Corporation
InventorsKoji WATANABE, Hiroaki OZOE
Life of this patent
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Abstract
Provided is a resin composition for three-dimensional photofabrication which, after curing, melts at a relatively low temperature of about 200° C. and which is excellent in fabricability. The present invention relates to a resin composition for three-dimensional photofabrication, containing a reactive material having in a molecule thereof an acetal structure and a crosslinkable double bond.
Claims11
A resin composition for three-dimensional photofabrication, comprising
- a reactive material having in a molecule thereof an acetal structure and a crosslinkable double bond,
- wherein the reactive material is a reaction product of a compound having two or more crosslinkable double bonds with an alcohol compound having a crosslinkable double bond, or with a carboxylic acid compound having a crosslinkable double bond.
(canceled)
Dependencies are inferred from the claim text.