Silanol-based composite composition
OwnerStefan Henneck, Tobias Kohlerinventors
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OwnerStefan Henneck, Tobias Kohlerinventors
Estimating the term…
A composite composition for forming a composite which can be used for potting electronics and/or electrics, in particular power electronics. To form a composite which is solid, in particular rigid, adhesive, in particular self-adhesive, thermally stable, and has a low coefficient of thermal expansion, high thermal conductivity and thermal diffusivity, and high thermal endurance, and protects and compressively stabilizes electronics and/or electrics and increases their lifespan and/or performance, the composite composition includes, relative to the total weight of the composite composition, ≥10 wt. % to ≤95 wt. % of at least one filler, and ≥1 wt. % to ≤15 wt. % of at least one silanol. A method for preparing a silanol composition; a corresponding silanol composition; a method for preparing the composite composition; a method for preparing a composite and/or a solid structure; a composite and/or a solid structure; and the use thereof, are also described.
1-30. (canceled)
A composite composition for forming a composite for potting electronics and/or electrics, wherein the composite composition comprises, relative to a total weight of the composite composition,
A method for producing a silanol composition for a composite composition, the composite composition including, relative to a total weight of the composite composition, ≥10 wt. % to ≤95 wt. % of at least one filler, and ≥1 wt. % to ≤15 wt. % of at least one silanol, the method comprising:
A silanol composition, for application with at least one ceramic and/or metallic filler and/or to a metallic and/or ceramic material, wherein the silanol composition, relative to a total weight of the silanol composition, comprises:
A method for producing a composite composition comprising:
A method for producing a composite and/or a solid structure in the form of a potting and/or casting and/or coating, in which a composite composition including, relative to a total weight of the composite composition, ≥10 wt. % to ≤95 wt. % of at least one filler, and ≥1 wt. % to ≤15 wt. % of at least one silanol is cured at a temperature in a range of ≥130° C.
A electronics and/or electrics composite potting comprising a composite composition including, relative to a total weight of the composite composition, ≥10 wt. % to ≤95 wt. % of at least one filler, and ≥1 wt. % to ≤15 wt. % of at least one silanol, cured at a temperature in a range of ≥130° C.
Dependencies are inferred from the claim text.