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US 2024/0350690 A1Published application
Electroless antipathogenic coating
OwnerAmbrose Schaffer, Jean Laplante +1inventors
InventorsAmbrose Schaffer, Jean Laplante, Matthew Wojcik
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Abstract
An electroless nickel-copper-phosphorous coating includes at least about 30% by weight Cu: about 5% to about 15% by weight P; and the balance Ni, with incidental impurities. The electroless nickel-copper-phosphorus coating exhibits antipathogenic properties and enhanced wear when deposited on a substrate.
Claims25
An aqueous electroless nickel-copper-phosphorous plating bath for forming an antipathogenic coating on a substrate, the plating bath comprising:
- about 2.0 g/l to about 8.0 g/l Ni;
- about 150 ppm to about 1500 ppm Cu;
- about 10 g/l to about 50 g/l hypophosphorous reducing agent;
- wherein the electroless nickel-copper-phosphorous bath provides a uniform electroless nickel-copper-phosphorous deposit on the substrate that is antipathogenic and/or oligodynamic.
1 more element
An electroless nickel-copper-phosphorous coating, comprising:
- at least about 30% by weight Cu;
- about 5% to about 15% by weight P;
- and the balance Ni, with incidental impurities.
(canceled)
Dependencies are inferred from the claim text.