Printing components to substrate posts
AssigneeX Display Company Technology Limited
InventorsDavid Gomez, Christopher Andrew Bower, Raja Fazan Gul, António José Marques Trindade, Ronald S. Cok
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Abstract
A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.
Claims14
1-25. (canceled)
A module structure, comprising:
- a patterned substrate having a substrate surface and comprising a substrate post protruding from the substrate surface;
- and
- a component disposed on the substrate post, the component having a component top side and a component bottom side opposite the component top side, the component bottom side disposed on the substrate post, the component extending over at least one edge of the substrate post;
- and
- one or more component electrodes disposed on the component.
Dependencies are inferred from the claim text.