Acoustic wave device with multi-layer piezoelectric substrate with heat dissipation

A method of filtering a radio frequency signal heat dissipation, the method comprising:

• providing a radio frequency signal to a filter, the filter being a transmit filter, the filter including an acoustic wave resonator that includes a support substrate, a piezoelectric layer, an interdigital transducer electrode on the piezoelectric layer, and a thermally conductive layer having a higher thermal conductivity than the piezoelectric layer, the thermally conductive layer positioned between the support substrate and the piezoelectric layer, the thermally conductive layer having a thickness of at least 10 nanometers and less than a thickness of the piezoelectric layer;
• and
• filtering the radio frequency signal with the filter such that a maximum surface temperature of a filter chip that includes the filter is less than 60º Celsius during operation of the filter.