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US 2024/0347478 A1Published application
Substrate alpha particle shield for semiconductor packages
AssigneeMicron Technology, Inc.
InventorsChen-Yu HUANG, Chong Leong GAN
Life of this patent
Estimating the term…
Abstract
Implementations described herein relate to various semiconductor device assemblies. In some implementations, a semiconductor device assembly may include a substrate, a plurality of electrical contacts disposed on an outer surface of the substrate, a solder resist disposed on the outer surface of the substrate and including an opening defined by a plurality of edges and exposing the plurality of electrical contacts, and an alpha particle shield disposed proximate to at least one edge, of the plurality of edges.
Claims20
A semiconductor device assembly, comprising:
- a substrate;
- a plurality of electrical contacts disposed on an outer surface of the substrate;
- a solder resist disposed on the outer surface of the substrate and including an opening defined by a plurality of edges and exposing the plurality of electrical contacts;
- and
- an alpha particle shield disposed proximate to at least one edge, of the plurality of edges.
2 more elements
A memory device, comprising:
- a substrate;
- a plurality of electrical contacts disposed on an outer surface of the substrate;
- a solder resist disposed on the outer surface of the substrate and at least partially surrounding the plurality of electrical contacts;
- a semiconductor die electrically coupled to the substrate via the plurality of electrical contacts;
- and
- an alpha particle shield disposed between at least a portion of the solder resist and at least a portion of the semiconductor die.
3 more elements
Dependencies are inferred from the claim text.