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US 2024/0344779 A1Published application
Flow rate adjustment device
AssigneeIHI Corporation
InventorsZhihong LIU, Atsushi ISHIKAWA
Life of this patent
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Abstract
A flow rate adjustment device includes: an adjustment unit including a pipe and a sealing plate provided below an outlet of the pipe, the sealing plate having a sealing surface; and a moving unit that moves the sealing plate to a sealing position where the sealing surface of the sealing plate is positioned vertically below the outlet of the pipe and a retraction position where the sealing surface of the sealing plate is retracted from a point vertically below the outlet of the pipe.
Claims8
A flow rate adjustment device comprising:
- an adjustment unit including a pipe and a sealing plate provided below an outlet of the pipe, the sealing plate having a sealing surface;
- and
- a moving unit that moves the sealing plate to a sealing position where the sealing surface of the sealing plate is positioned vertically below the outlet of the pipe and a retraction position where the sealing surface of the sealing plate is retracted from a point vertically below the outlet of the pipe.
Dependencies are inferred from the claim text.