Furnace and semiconductor processing equipment
AssigneeLaplace Renewable Energy Technology Co., Ltd.
InventorsQinghua Chang, Tairong Zhu, Wu Zhang, Qun Liu
Life of this patent
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Abstract
A furnace and a semiconductor processing equipment are provided. The furnace includes a furnace body and a heat exchange device, the furnace body includes a furnace tube and an insulation layer disposed around the furnace tube, a heat exchange gas channel is formed between an outer wall of the furnace tube and the insulation layer, the heat exchange gas channel includes a first gas inlet and a first gas outlet. The heat exchange device includes a gas flow channel and a cooling channel, the gas flow channel is connected to the first gas outlet, the cooling channel provides a cooling medium for exchanging heat with a gas in the gas flow channel.
Claims20
A furnace comprising:
- a furnace body comprising a furnace tube and an insulation layer disposed around the furnace tube, a heat exchange gas channel formed between an outer wall of the furnace tube and the insulation layer, the heat exchange gas channel comprising a first gas inlet and a first gas outlet;
- and
- a heat exchange device comprising a gas flow channel and a cooling channel, the gas flow channel connected to the first gas outlet, the cooling channel configured to provide a cooling medium for exchanging heat with a gas in the gas flow channel.
A semiconductor processing equipment comprising:
- a furnace comprising:
- a furnace body comprising a furnace tube and an insulation layer disposed around the furnace tube, a heat exchange gas channel formed between an outer wall of the furnace tube and the insulation layer, the heat exchange gas channel comprising a first gas inlet and a first gas outlet;
- a heat exchange device comprising a gas flow channel and a cooling channel, the gas flow channel connected to the first gas outlet, the cooling channel configured to provide a cooling medium for exchanging heat with a gas in the gas flow channel;
- and
- a gas supply system connected to the first gas inlet and configured to supply heat exchange gas into the heat exchange gas channel through the first gas inlet.
Dependencies are inferred from the claim text.