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US 2024/0343941 A1Published application
Dual-cure resin composition comprising uretdione-containing compound and its use in 3d printing
AssigneeBASF SE
InventorsRui DING, Zhi Zhong CAI, Yue WANG
Life of this patent
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Abstract
This disclosure relates to a dual-cure resin composition comprising (a) at least one photo-polymerizable compound; (b) at least one uretdione-containing compound having an average uretdione ring functionality of greater than 1; (c) at least one compound containing at least one isocyanate-reactive group; and (d) at least one photoinitiator; to a process of forming 3D objects by using the composition, to use of the composition for forming 3D objects and to 3D objects formed by using the composition.
Claims18
-17. (canceled)
A dual-cure resin composition comprising
- (a) at least one photo-polymerizable compound;
- (b) at least one uretdione-containing compound having an average uretdione ring functionality of greater than 1;
- (c) at least one compound containing at least one isocyanate-reactive group;
- and
- (d) at least one photoinitiator.
2 more elements
Dependencies are inferred from the claim text.