Highly integrated power electronics and methods of manufacturing the same
AssigneeToyota Motor Engineering & Manufacturing North America, Inc.
InventorsFeng Zhou, Tianzhu Fan, Ercan Mehmet Dede
Life of this patent
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Abstract
A method of fabricating or manufacturing a highly integrated power electronics (IPEs) embedded printed circuit board (PCB)—cold plate assembly includes bonding a cold plate substrate onto a first side of a power device—substrate assembly, bonding a multi-layer PCB onto a second side of the power device—substrate assembly, and bonding a cold plate manifold onto the multi-layer PCB and forming a cold plate in thermal communication a power device of the power device—substrate assembly. The multi-layer PCB can be 3D printed onto the second side of the power device—substrate assembly and bonding of the cold plate manifold to the multi-layer PCB can be reinforced with mechanical fasteners.
Claims20
A method comprising:
- bonding a cold plate substrate onto a first side of a power device—substrate assembly;
- bonding a multi-layer printed circuit board (PCB) onto a second side of the power device—substrate assembly;
- and
- bonding a cold plate manifold onto the multi-layer PCB and forming a cold plate and a high integrated power electronics embedded PCB—cold plate assembly with the cold plate.
A method comprising:
- bonding a cold plate substrate onto a first side of a power device—substrate assembly;
- 3D printing a multi-layer printed circuit board (PCB) onto a second side of the power device—substrate assembly;
- bonding a cold plate manifold onto the multi-layer PCB and forming a cold plate;
- and
- installing a plurality of mechanical fasteners to reinforce the cold plate manifold bonded to the multi-layer PCB.
A method comprising:
- bonding a cold plate substrate onto a first side of a power device—substrate assembly;
- 3D printing a multi-layer printed circuit board (PCB) onto a second side of the power device—substrate assembly;
- bonding a polymer cold plate manifold onto the multi-layer PCB and forming, in combination with the cold plate substrate, a cold plate;
- and
- installing a plurality of mechanical fasteners to reinforce the polymer cold plate manifold bonded to the multi-layer PCB.
Dependencies are inferred from the claim text.