Embedded cooling systems for device packages and methods of cooling packaged devices
OwnerCyprian Emeka Uzoh, Belgacem Haba +1inventors
InventorsCyprian Emeka Uzoh, Belgacem Haba, Rajesh Katkar
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Abstract
Embodiments herein provide for device packages comprising an integrated cooling assembly and methods of cooling packaged devices. The integrated cooling assembly comprising a semiconductor device, a manifold attached to the semiconductor device, and a sonic transducer attached to the manifold. The manifold comprises a top portion and a waveguide extending downwardly from the top portion. The sonic transducer is attached to the top portion. The top portion, the waveguide, and a backside of the semiconductor device collectively define a coolant chamber volume therebetween.
Claims23
A device package comprising:
- an integrated cooling assembly comprising a semiconductor device, a manifold attached to the semiconductor device, and a sonic transducer attached to the manifold, wherein:
- the manifold comprises a top portion and a waveguide extending downwardly from the top portion;
- the sonic transducer is attached to the top portion;
- and
- the top portion, the waveguide, and a backside of the semiconductor device collectively define a coolant chamber volume therebetween.
-57. (canceled)
Dependencies are inferred from the claim text.