Single crystalline aluminum nitride substrate and optoelectronic devices made therefrom
AssigneeHexatech, Inc.
InventorsRafael Dalmau, Raoul Schlesser, Samuel Kirby, Jeffrey Britt
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AssigneeHexatech, Inc.
InventorsRafael Dalmau, Raoul Schlesser, Samuel Kirby, Jeffrey Britt
Estimating the term…
The present disclosure provides a method for forming an aluminum nitride single crystalline substrate that includes growing an AlN single crystalline boule followed by cooling the AlN single crystalline boule in three phases including a first cooling phase from the crystal growth temperature to a first intermediate temperature of about 1900° C. to about 1800° C., a second cooling phase from the first intermediate temperature to a second intermediate temperature of about 1500° C. to about 1400° C., wherein the second cooling phase is characterized by a cooling rate of 5.0° C. per minute or less, and a third cooling phase from the second intermediate temperature to room temperature. Also provided is an aluminum nitride single crystalline substrate having a dimensionless figure of merit (FOM) of 0.4 or above and optoelectronic devices made therefrom.
A method for forming an aluminum nitride single crystalline substrate,
An aluminum nitride single crystalline substrate having a diameter of 2 inches or greater, wherein a 2-inch diameter portion of the substrate has a dimensionless figure of merit (FOM) of 0.4 or above, the FOM having the formula of:
Dependencies are inferred from the claim text.