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US 2024/0321663 A1Published application
High-performance stress buffer die-coat and devices and processes implementing the same
AssigneeWolfspeed, Inc.
InventorsAfshin DADVAND, Dev BALARAMAN
Life of this patent
Estimating the term…
Abstract
A device may include device parts, a composite coating material arranged on one or more of the device parts, and a molding compound arranged on and/or around one or more of the device parts. Moreover, the device may include where the composite coating material may include a polymer matrix including and/or incorporating ceramic particles.
Claims37
A device comprising:
- device parts;
- a composite coating material arranged on one or more of the device parts;
- and
- a molding compound arranged on and/or around one or more of the device parts,
- wherein the composite coating material comprises a polymer matrix including and/or incorporating ceramic particles.
2 more elements
A process of manufacturing a device comprising:
- providing device parts;
- arranging a composite coating material on one or more of the device parts;
- and
- arranging a molding compound on and/or around one or more of the device parts,
- wherein the composite coating material comprises a polymer matrix including and/or incorporating ceramic particles.
2 more elements
-36. (canceled)
-43. (canceled)
-50. (canceled)
Dependencies are inferred from the claim text.