Insulating film forming method and substrate processing system
AssigneeTokyo Electron Limited
InventorsDaisuke OBA, Masafumi ISHIDA, Nobuo MATSUKI, Yoshinori MORISADA
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Abstract
A method of forming an insulating film on a substrate having a recess, includes preparing the substrate inside a chamber of a processing apparatus, forming a flowable oligomer film on the substrate by supplying a processing gas containing a raw material gas and a diluent gas into the chamber and generating a flowable oligomer by plasma polymerization, controlling an interior of the chamber to have a pressure equal to or lower than a vapor pressure of the flowable oligomer to partially vaporize and remove the flowable oligomer film, and forming the insulating film in the recess by supplying energy to the substrate to cure the flowable oligomer.
Claims32
A method of forming an insulating film on a substrate having a recess, the method comprising:
- preparing the substrate inside a chamber of a processing apparatus;
- forming a flowable oligomer film on the substrate by supplying a processing gas containing a raw material gas and a diluent gas into the chamber and generating a flowable oligomer by plasma polymerization;
- controlling an interior of the chamber to have a pressure equal to or lower than a vapor pressure of the flowable oligomer to partially vaporize and remove the flowable oligomer film;
- and
- forming the insulating film in the recess by supplying energy to the substrate to cure the flowable oligomer.
A substrate processing system comprising:
- a plurality of processing apparatuses configured to process a substrate having a recess;
- a transfer mechanism configured to transfer the substrate among the plurality of processing apparatuses;
- and
- a controller configured to execute a process,
- wherein the process comprises:
- transferring the substrate to any of the plurality of processing apparatuses by the transfer mechanism;
- forming a flowable oligomer film on the substrate by supplying a processing gas containing a raw material gas and a diluent gas into the chamber and generating a flowable oligomer by plasma polymerization;
- controlling the interior of the chamber to have a pressure equal to or lower than the vapor pressure of the flowable oligomer to partially vaporize and remove the flowable oligomer film;
- and
- forming an insulating film in the recess by supplying energy to the substrate to cure the flowable oligomer.
Dependencies are inferred from the claim text.