Process for Polishing and Grinding Copper Foil Surface for Reducing Roughness Thereof
AssigneeTaichi Metal Material Technology Co., Ltd.
InventorsKuan-Wei Chen, Kuan-Yu Chen, Jason Shian-Ching Jang
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Abstract
A process for polishing and grinding a copper foil surface comprises implementing a main roller made of soft, porous, fibrous and compressible materials, and placing a plurality of metallic-glass particles injected, impinged or applied to the peripheral surface of the main roller, whereby upon rotation of the main roller to contact and brush the copper foil surface, each metallic-glass particle as cushioned by the main roller may simultaneously polish and grind the copper foil surface for efficiently reducing roughness of copper foil.
Claims4
A process for polishing and grinding a copper foil surface comprising:
- implementing a main roller, which is made of soft, porous, fibrous and compressible materials for brushing a copper foil;
- and placing a plurality of metallic-glass particles to be injected, impinged, or applied to a peripheral surface of the main roller to allow each said metallic-glass particle to be partially received in the peripheral surface of the main roller, and to protrude an upper portion of each said metallic-glass particle outwardly as cushioned by the main roller, whereby upon rotation of the main roller to contact the copper foil surface, the copper foil surface will be brushed by said main roller, and each said metallic-glass particle, as compressed in the main roller to restore a restoring elastic force, will be urged outwardly by the restoring elastic force from the main roller to forcibly polish and grind the copper foil surface, thereby simultaneously and cooperatively brushing, polishing and grinding the copper foil surface for efficiently reducing roughness of the copper foil.
Dependencies are inferred from the claim text.