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US 2024/0304475 A1Published application
Bonding apparatus, bonding system, and bonding method
OwnerKenji Sugakawa, Tetsuya Makiinventors
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Abstract
A bonding apparatus includes a first holder, a second holder, a striker and an ionizer. The first holder is configured to attract and hold a first substrate from above. The second holder is disposed below the first holder and is configured to attract and hold a second substrate from below. The striker is configured to press a central portion of the first substrate into contact with the second substrate. The ionizer is disposed above the second holder.
Claims8
A bonding apparatus, comprising:
- a first holder configured to attract and hold a first substrate from above;
- a second holder, disposed below the first holder, configured to attract and hold a second substrate from below;
- a striker configured to press a central portion of the first substrate into contact with the second substrate;
- and
- an ionizer disposed above the second holder.
2 more elements
A bonding system, comprising:
- a surface modifying apparatus configured to modify surfaces of a first substrate and a second substrate;
- a surface hydrophilizing apparatus configured to hydrophilize the modified surfaces of the first substrate and the second substrate;
- and
- a bonding apparatus configured to bond the hydrophilized first and second substrates by an intermolecular force,
- wherein the bonding apparatus comprises:
- a first holder configured to attract and hold the first substrate from above;
- a second holder, disposed below the first holder, configured to attract and hold the second substrate from below;
- a striker configured to press a central portion of the first substrate into contact with the second substrate;
- and
- an ionizer disposed above the second holder.
7 more elements
Dependencies are inferred from the claim text.