Cutting device and cutting method
AssigneeSeiko Epson Corporation
InventorMakoto YOSHIDA
Life of this patent
Estimating the term…
Abstract
A cutting device includes a cutter configured to cut a web including at least accumulated fibers and a ball screw mechanism configured to move the cutter in a transportation direction of the web, and the cutter, when the web is being transported, cuts the web in a direction intersecting the transportation direction while being moved in the transportation direction of the web by the ball screw mechanism.
Claims7
A cutting device configured to be disposed on a transportation path along which a web including at least accumulated fibers is transported and configured to cut the web, the cutting device comprising:
- a cutter configured to cut the web;
- and
- a ball screw mechanism configured to move the cutter in a transportation direction of the web, wherein
- when the web is being transported, the ball screw mechanism moves the cutter in the transportation direction of the web, and while the cutter is being moved, the cutter cuts the web in a direction intersecting the transportation direction.
A cutting method using a cutting device disposed on a transportation path along which a web including at least accumulated fibers is transported and including a cutter configured to cut the web and a ball screw mechanism configured to move the cutter in a transportation direction of the web, the cutting method comprising
- cutting the web with the cutter, when the web is being transported, in a direction intersecting the transportation direction while the ball screw mechanism is moving the cutter in the transportation direction of the web.
Dependencies are inferred from the claim text.